Wire bonding method

Details Wire bonding method Wire bonding method

2006-04-11

2006-04-11

Kerns, Kevin (Department: 1725)

Metal fusion bonding

Process

Plural joints

C228S004500

Reexamination Certificate

active

07025247

ABSTRACT:
A wire bonding method including the steps of forming a bump by performing ball bonding of a ball by wire on a second conductor, raising a capillary to a height that is equal to or lower than the height of a ball portion that rises into a through-hole of the capillary during formation of the bump, moving the capillary in a direction that is opposite from the first conductor, lowering the capillary so as to form an inclined wedge on the bump, cutting the wire, performing the primary bonding on the first conductor, and making a loop with the wire with respect to the bump from the first conductor, thus performing the secondary bonding on the inclined wedge on the bump.

REFERENCES:
patent: 5485949 (1996-01-01), Tomura et al.
patent: 6715666 (2004-04-01), Imai et al.
patent: 2004/0026480 (2004-02-01), Imai et al.
patent: 10-112471 (1998-04-01), None
patent: 2002-280410 (2002-09-01), None

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