Wire bonding method

Details Wire bonding method Wire bonding method

2011-05-03

2011-05-03

Ward, Jessica L (Department: 1735)

Metal fusion bonding

Process

Plural joints

C228S004500

Reexamination Certificate

active

07934634

ABSTRACT:
A wire bonding method with the process of performing a first bonding to a pad of a die that is a first bond point, and the process of performing a second bonding to an interconnect wiring (or a lead) that is a second bond point, thus connecting the pad and the interconnect wiring with a wire. A bump is first formed on a pad, and, in a wire cutting step performed during the step of forming the bump, the wire protruding from the tip end of a capillary is bent in the lateral direction to form a bent part, and then the bent part is bonded to the bump, thus completing the first bonding process; after which the wire is bonded to the interconnect wiring, thus completing the second bonding process.

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