Wire bonding method

Details Wire bonding method Wire bonding method

1999-10-08

2000-09-05

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

228 11, 2281101, 219 561, 219 5621, 219 5622, B23K 3100, B23K 3102, B23K 106, B23K 520, B23K 3700

Patent

active

061129747

ABSTRACT:
A wire bonding method comprising the steps of raising a capillary after bonding a ball formed on the tip end of the wire extending from the tip end of a capillary to a first bonding point, moving the capillary to a position located at an upward inclination in the direction of a second bonding point, further moving the capillary to a position located at an upward inclination in the opposite direction from the second bonding point, then moving the capillary to a position located at an upward inclination in the direction of the second bonding point, and then lowering the capillary so that the wire is bonded to the second bonding point by the capillary, thus producing a stable low-height M-shaped wire loop between the first and second bonding point.

REFERENCES:
patent: 4068371 (1978-01-01), Miller
patent: 4932584 (1990-06-01), Yamazaki et al.
patent: 5148964 (1992-09-01), Shimizu
patent: 5205463 (1993-04-01), Holdgrafer et al.
patent: 5259548 (1993-11-01), Yamazaki et al.
patent: 5863810 (1999-01-01), Kaldenberg
patent: 5884398 (1999-03-01), Eldridge et al.
patent: 5989995 (1999-11-01), Nishiura et al.

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