Wire bonding method

Details Wire bonding method Wire bonding method

1997-12-29

1999-10-19

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228 45, H01L 2160

Patent

active

059674016

ABSTRACT:
A method for moving a capillary so as to connect wire to a first bonding point and then to a second bonding point in manufacturing, for instance, semiconductor devices, including the steps of moving the capillary in a opposite direction from the second bonding point after moving the capillary away from the first bonding point, and then moving the capillary slightly towards the first bonding point so as to form a firm kink in the wire, and after which the capillary is further moved away from the first bonding point delivering the wire, and then the capillary is moved towards the second bonding point to connect the wire to the second bonding point.

REFERENCES:
patent: 4327860 (1982-05-01), Kirshenboin et al.
patent: 4932584 (1990-06-01), Yamazaki et al.
patent: 4976392 (1990-12-01), Smith et al.
patent: 5111989 (1992-05-01), Holdgrafer et al.
patent: 5192018 (1993-03-01), Terakado et al.

Affiliated with

Also associated with

Rating

Wire bonding method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wire bonding method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wire bonding method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2045892