Wire bonding method

Details Wire bonding method Wire bonding method

1998-03-05

2000-03-28

Ryan, Patrick

Metal fusion bonding

Process

With shaping

2281411, 228178, 228 45, 228 51, 2281805, H01L 2100

Patent

active

060419954

ABSTRACT:
In a wire bonding method, particularly a method for forming a ball at an end of a bonding wire that has an intended ball size, a tail length of the bonding wire extending from the lower end of a capillary is determined according to the size of the intended ball and the internal shape of the lower end portion of the capillary, and the wire end having such a tail length is melted up to the lower end surface of the capillary by a discharge produced by an electric torch so as to form a ball on the wire end.

REFERENCES:
patent: 4482794 (1984-11-01), Kurtz et al.
patent: 5176310 (1993-01-01), Akiyama et al.
patent: 5871141 (1999-02-01), Hadar et al.

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