Wire bonding method

Details Wire bonding method Wire bonding method

1998-01-12

1999-10-05

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

228 11, 2281101, B23K 3102, B23K 106

Patent

active

059610298

ABSTRACT:
A method for connecting a first bonding point and a second bonding point with a wire comprising the steps of: raising a capillary through which the wire passes slightly after the second reverse operation that involves the movement of the capillary in the opposite direction from a second bonding point, moving the capillary to a position which is more or less above the first bonding pint, and then raising the capillary while delivering the wire; resulting in the formation of a kink in the inclined portion of a trapezoidal wire loop employed in the wire connection in semiconductor devices.

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