Metal fusion bonding – Process – Plural joints
Patent
1992-06-19
1993-11-09
Ramsey, Kenneth J.
Metal fusion bonding
Process
Plural joints
H01L 2060
Patent
active
052595480
ABSTRACT:
In order to avoid an excessive wire loop curvature at a second bonding point, a wire bonding is performed with the steps of: moving the capillary, after the wire is connected to a first bonding point, toward the second bonding point, and right before the capillary comes above the second bonding point, the capillary is moved down obliquely so that the capillary is positioned exactly above the second bonding point, and then the capillary is moved down straight so that the wire is pressed against the second bonding point.
Mii Tatsunari
Sugiura Kazuo
Takahashi Kuniyuki
Torihata Minoru
Yamazaki Nobuto
Kabushiki Kaisha Shinkawa
Ramsey Kenneth J.
LandOfFree
Wire bonding method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wire bonding method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wire bonding method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1137762