Wire bonding method

Details Wire bonding method Wire bonding method

1989-07-27

1991-02-19

Seidel, Richard K.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228110, 228111, B23K 2010

Patent

active

049936182

ABSTRACT:
A wire bonding method for connecting a pad of a semiconductor chip and an inner lead with a bonding wire, which comprises the steps of pressing a ball formed on an end of the bonding wire to the pad, and applying ultrasonic waves to the ball, while the output of the ultrasonic waves is reduced after a predetermined period of time from the beginning of the step of pressing.

REFERENCES:
patent: 4571688 (1986-02-01), Kashihara et al.
patent: 4603802 (1986-08-01), Kurtz et al.
patent: 4696425 (1987-09-01), Landes

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