Wire bonding method

Details Wire bonding method Wire bonding method

1998-03-05

2000-03-14

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

228 45, 228102, 228213, B23K 3102, B23K 3700, B23K 100, B23K 522

Patent

active

060360801

ABSTRACT:
A wire bonding method for bonding a first bonding point and then a second bonding point by bonding wire that passes through a capillary including a reverse operation that moves the capillary in a direction opposite from a second bonding point after the bonding is done to the first bonding point, a damper is closed temporarily during the reverse operation so as to apply tension to the wire, thus forming a strong kink at an uppermost point of the neck height portion of a resulting wire loop between the first and second bonding points.

REFERENCES:
patent: 4932584 (1990-06-01), Yamazaki et al.
patent: 5156323 (1992-10-01), Kumazawa et al.
patent: 5205463 (1993-04-01), Holdgrafer et al.

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