Wire bonding apparatus

Details Wire bonding apparatus Wire bonding apparatus

1993-12-02

1995-03-07

Ramsey, Kenneth J.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228 9, H01L 2160

Patent

active

053950356

ABSTRACT:
In the first operating unit, the bonding gap and the loop length of the bonding wire are calculated from the first and second bonding points. In the second operating unit, the length of the oblique line of the bonding wire, and the angle made between the oblique line and a line connecting the inner lead and the bed together are calculated from the bonding gap, the loop length, and the loop height. In the automatic operating unit, the reverse height, i.e. the distance by which the capillary is moved upward from the bonding pad position, the reverse amount, i.e. the distance by which the capillary, already ascended to the reverse height, is moved to the opposite side of the bonding position, and the capillary ascending amount, i.e. the distance by which the capillary, already moved by the reverse amount, is moved to the highest position of the capillary from the upper surface of the semiconductor chip are calculated from the length of the oblique line, the angle, and the loop height.

REFERENCES:
patent: 4327860 (1982-05-01), Kirshenboin et al.
patent: 4445633 (1984-05-01), Bonham, Jr.
patent: 4445633 (1984-05-01), Bonham, Jr.
patent: 5148964 (1992-09-01), Shimizu
patent: 5150828 (1992-09-01), Shimizu
patent: 5156323 (1992-10-01), Kumazawa et al.

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