Wire bonders and methods of wire-bonding

Electric heating – Metal heating – Cutting or disintegrating

Reexamination Certificate

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Details

C219S056220, C219S068000, C219S069170, C228S004500

Reexamination Certificate

active

10635947

ABSTRACT:
Wire bonders and methods of wire-bonding are disclosed herein. In one embodiment, a method includes attaching a wire to a terminal of a microelectronic component and generating an arc between a first electrode and a second electrode to sever the wire at a point at least proximate to the first and second electrodes. In another embodiment, a wire bonder includes a bond head having a capillary, a first electrode and a second electrode each disposed relative to the bond head, and a controller operably coupled to the first and second electrodes. The controller has a computer-readable medium containing instructions to perform the above-mentioned method.

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