4. Electric heating
  5. Metal heating
  6. Cutting or disintegrating

Stuart L. Roberts

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Alignment and orientation features for a semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Alignment marks
Reexamination Certificate

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Alignment and orientation features for a semiconductor package

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Alignment and orientation features for a semiconductor package

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method and apparatus for testing a semiconductor package

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate

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Packaged microdevices and methods for manufacturing packaged...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2235079

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