Electric heating – Metal heating – Cutting or disintegrating
Reexamination Certificate
2011-07-12
2011-07-12
Evans, Geoffrey S (Department: 3742)
Electric heating
Metal heating
Cutting or disintegrating
C219S056220, C219S068000
Reexamination Certificate
active
07977597
ABSTRACT:
Wire bonders and methods of wire-bonding are disclosed herein. In one embodiment, a method includes attaching a wire to a terminal of a microelectronic component and generating an arc between a first electrode and a second electrode to sever the wire at a point at least proximate to the first and second electrodes. In another embodiment, a wire bonder includes a bond head having a capillary, a first electrode and a second electrode each disposed relative to the bond head, and a controller operably coupled to the first and second electrodes. The controller has a computer-readable medium containing instructions to perform the above-mentioned method.
REFERENCES:
patent: 3553417 (1971-01-01), Smith et al.
patent: 4387283 (1983-06-01), Peterson et al.
patent: 4528435 (1985-07-01), Billon-Pierron et al.
patent: 4594493 (1986-06-01), Harrah et al.
patent: 5062565 (1991-11-01), Wood et al.
patent: 5095187 (1992-03-01), Gliga
patent: 5176310 (1993-01-01), Akiyama et al.
patent: 5263631 (1993-11-01), Felber et al.
patent: 5322207 (1994-06-01), Fogal et al.
patent: 5601740 (1997-02-01), Eldridge et al.
patent: 5773780 (1998-06-01), Eldridge et al.
patent: 5829128 (1998-11-01), Eldridge et al.
patent: 5891796 (1999-04-01), Nakamura et al.
patent: 5958259 (1999-09-01), Miyano et al.
patent: 5986209 (1999-11-01), Tandy
patent: 6025728 (2000-02-01), Hembree et al.
patent: 6130474 (2000-10-01), Corisis
patent: 6165887 (2000-12-01), Ball
patent: 6247629 (2001-06-01), Jacobson et al.
patent: 6258624 (2001-07-01), Corisis
patent: 6259153 (2001-07-01), Corisis
patent: 6261865 (2001-07-01), Akram
patent: 6315190 (2001-11-01), Nishiura
patent: 6336269 (2002-01-01), Eldridge et al.
patent: 6739493 (2004-05-01), Thuerlemann
patent: 6784394 (2004-08-01), Nishiura et al.
patent: 7227095 (2007-06-01), Roberts et al.
patent: 54158081 (1979-12-01), None
patent: 59150435 (1984-08-01), None
patent: 61-14817 (1986-01-01), None
patent: 10135220 (1998-05-01), None
patent: 2000-323517 (2000-11-01), None
patent: 2000323517 (2000-11-01), None
Machine translation of Japan Patent document No. 2000-323,517, Jul. 2009.
Fogal Rich
Roberts Stuart L.
Evans Geoffrey S
Micro)n Technology, Inc.
Perkins Coie LLP
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