Wire bonder for ball bonding insulated wire and method of...

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder

Reexamination Certificate

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Details

C228S001100, C228S110100, C228S180500

Reexamination Certificate

active

07360675

ABSTRACT:
An electrical contact device is provided for electrically grounding an uninsulated end-portion of insulated wire stored on a spool driven by a device comprises the following. An electrical connector fixes to the spool and is configured to receive an electrical connection with the uninsulated end-portion of said insulated wire. A stationary electrical contact is provided for connecting to a ground. The stationary electrical contact is further configured to be placed about the shaft. A conductive bearing is also provided. The conductive bearing is configured to be placed about the shaft and between the electrical connector and the electrical contact. The conductive bearing electrically couples the electrical connector to said stationary electrical contact, thereby providing said ground to said uninsulated end-portion of said insulated bond wire. A wire-bonder including such a contact device and a method for making such a wire-bonder are also provided.

REFERENCES:
patent: 3627192 (1971-12-01), Killingsworth
patent: 4020543 (1977-05-01), Pennings
patent: 4513190 (1985-04-01), Ellett et al.
patent: 4586642 (1986-05-01), Dreibelbis et al.
patent: 4861533 (1989-08-01), Bertin et al.
patent: 4909427 (1990-03-01), Plaisted et al.
patent: 4950866 (1990-08-01), Kojima et al.
patent: 4976392 (1990-12-01), Smith et al.
patent: 4998002 (1991-03-01), Okikawa et al.
patent: 5031821 (1991-07-01), Kaneda et al.
patent: 5037023 (1991-08-01), Akiyama et al.
patent: 5110032 (1992-05-01), Akiyama et al.
patent: 5152450 (1992-10-01), Okikawa et al.
patent: 5176310 (1993-01-01), Akiyama et al.
patent: 5285949 (1994-02-01), Okikawa et al.
patent: 6156990 (2000-12-01), Ellis
patent: 6439496 (2002-08-01), Terakado et al.
patent: 6896170 (2005-05-01), Lyn et al.
patent: 2001/0002038 (2001-05-01), Terakado et al.
patent: 2003/0234275 (2003-12-01), Lyn et al.
patent: 2517017 (1975-04-01), None
patent: 3037735 (1980-10-01), None
patent: 0 355 955 (1989-06-01), None
patent: 62016537 (1987-01-01), None
patent: 05 13491 (1993-01-01), None
patent: 10 41335 (1998-02-01), None
patent: WO 2006060913 (2006-06-01), None

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