Wire bond padring bond pad checker program

Details Wire bond padring bond pad checker program Wire bond padring bond pad checker program

2006-06-13

2006-06-13

Do, Thuan (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000, C716S030000, C716S030000

Reexamination Certificate

active

07062741

ABSTRACT:
A computer-implemented method is described for verifying bond pad position conformity with predetermined design rules corresponding to a padring design. The padring design includes a plurality of linear arrays of bond pads. Horizontal and vertical scribelines for the padring design are defined. A first one of the linear arrays of bond pads is selected. Each bond pad has associated position values. Bond pad position data are determined with reference to the scribelines and the associated position values. The bond pad position data are compared to the predetermined design rules. Where violations of the predetermined design rules exist, the violations are identified.

REFERENCES:
patent: 6262587 (2001-07-01), Whetsel

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