Wire bond integrity test system

Details Wire bond integrity test system Wire bond integrity test system

2006-02-21

2006-02-21

Schillinger, Laura M. (Department: 2813)

Metal fusion bonding

Process

Plural joints

C228S004500, C228S110100, C438S011000, C438S014000

Reexamination Certificate

active

07000822

ABSTRACT:
An improved bond integrity test system is provided by eliminating the spring loaded wire spool cover which contributes to particulate matter, and by addition of a second contact diverter in the wire path. These improvements have been shown to decrease false lifted ball bond reports by 68%, and therefore to improve productivity and accuracy of the test system. Such changes are readily adapted to current bonders, as well as to new designs.

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