4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Insulating material

Raymond M. Partosa

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Method of fabricating wire bond integrity test system

Semiconductor device manufacturing: process – Including control responsive to sensed condition – Electrical characteristic sensed
Reexamination Certificate

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Porous ceramic work stations for wire and die bonders

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Wire bond integrity test system

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2675827

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