Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Patent
1997-09-19
1999-08-31
Ngo, Ngan V.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Housing or package filled with solid or liquid electrically...
257698, 257728, 257774, 257787, H01L 2322, H01L 2324
Patent
active
059457341
ABSTRACT:
An MMIC includes I/O pads on the back side coupled to active circuit structures on the front side by standard through-the-substrate vias. The front side is covered by a passivation layer and the back side I/O pads facilitate testing utilizing standard wafer probing equipment. The back side I/O pads are formed utilizing standard MMIC process technology.
REFERENCES:
patent: 5312765 (1994-05-01), Kanber
patent: 5343071 (1994-08-01), Kazior et al.
patent: 5347149 (1994-09-01), Bayvaktaroglu
patent: 5352998 (1994-10-01), Tanino
patent: 5406125 (1995-04-01), Johnson et al.
patent: 5510758 (1996-04-01), Fujita et al.
patent: 5528209 (1996-06-01), Macdonald et al.
patent: 5614743 (1997-03-01), Mochizuki
patent: 5694300 (1997-12-01), Mattei et al.
patent: 5717231 (1998-02-01), Tserng et al.
Ngo Ngan V.
Samsung Electronics Co,. Ltd.
LandOfFree
Wire-bond free input/output interface for GaAs ICs with means of does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wire-bond free input/output interface for GaAs ICs with means of, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wire-bond free input/output interface for GaAs ICs with means of will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2427090