Metal fusion bonding – Process – Plural joints
Patent
1997-04-08
1999-05-18
Heinrich, Samuel M.
Metal fusion bonding
Process
Plural joints
228212, H01L21/60
Patent
active
059042885
ABSTRACT:
A method of bonding wires which includes providing at least a first and second pair of bonding locations, one of each pair of bonding locations being subject to flexure in response to the application of a force thereagainst. A clamping force is applied against at least one of the bonding locations subject to flexure and a wire bond is formed to the first bonding locations subject to flexure. The clamping force is removed from the first bonding location subject to flexure and a clamping force is applied against the second of the bonding locations subject to flexure. A wire bond is formed to the second of the bonding locations subject to flexure and the clamping force is removed from the second of the bonding locations subject to flexure. The bonding steps include providing a first capillary and causing the first capillary to perform the step of bonding in a predetermined direction and providing a second capillary and causing the second capillary to perform the step of bonding in a direction normal to the predetermined direction. Preferably there are a plurality of first pairs of bonding locations and a plurality of second pairs of bonding locations.
REFERENCES:
patent: 3995845 (1976-12-01), Scheffer
patent: 5035034 (1991-07-01), Cotney
patent: 5197652 (1993-03-01), Yamazaki
patent: 5673845 (1997-10-01), Ball
Brady III Wade James
Donaldson Richard L.
Heinrich Samuel M.
Stewart Alan K.
Texas Instruments Incorporated
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