Wire bond and redistribution layer process

Details Wire bond and redistribution layer process Wire bond and redistribution layer process

2006-02-10

2009-06-02

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Making passive device

C438S283000, C438S617000, C257SE21022

Reexamination Certificate

active

07541251

ABSTRACT:
A manufacturing method of a semiconductor device with a copper redistribution line, a copper inductor and aluminum wire bond pads and the integration of the resulting device with an integrated circuit on a single chip, resulting in the decreased size of the chip.

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