Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1997-12-05
1999-07-27
Picardat, Kevin M.
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438613, 438618, H01L 2144
Patent
active
059306653
ABSTRACT:
A multi-layer circuit structure including a plurality of substrate layers. At least one planar transmission line, including microstrip, stripline, or coplanar line, disposed on the plurality of substrate layers. A via transmission line connected to that at least one planar transmission line and extending through the plurality of substrate layers. The via transmission lines having the same topology as the at least one planar transmission line for providing wide frequency band transition between the via transmission lines and the at least one planar transmission line.
REFERENCES:
patent: 4894114 (1990-01-01), Nathanson et al.
patent: 5646067 (1997-07-01), Gaul
patent: 5767009 (1998-06-01), Yoshida et al.
Cho Ching-Fai
Maiershofer Helmut Carl
Quil Avery Yee
Shin Do Bum
Collins Deven
Elbaum Saul
IT&T Industries, Inc.
Picardat Kevin M.
Plevy Arthur L.
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