Wet processing methods for the manufacture of electronic compone

Details Wet processing methods for the manufacture of electronic compone Wet processing methods for the manufacture of electronic compone

1996-07-19

2000-10-17

Chang, Ceila

Cleaning and liquid contact with solids

Processes

Using sequentially applied treating agents

134 10, 134 951, 216 99, 438689, 438698, 438704, 438706, 438734, 438749, 156345, B08B 704

Patent

active

061325228

ABSTRACT:
The present invention is directed to wet processing methods for the manufacture of electronic component precursors, such as semiconductor wafers used in integrated circuits. More specifically, this invention relates to methods, for example, prediffusion cleaning, stripping, and etching of electronic component precursors using sequential chemical processing techniques.

REFERENCES:
patent: 3650960 (1972-03-01), Strauss et al.
patent: 4277290 (1981-07-01), Andrews et al.
patent: 4498953 (1985-02-01), Cook et al.
patent: 4560417 (1985-12-01), Bardina et al.
patent: 4577650 (1986-03-01), McConnell
patent: 4582390 (1986-04-01), Furuya
patent: 4633893 (1987-01-01), McConnell et al.
patent: 4654089 (1987-03-01), Singelyn et al.
patent: 4711256 (1987-12-01), Kaiser
patent: 4738272 (1988-04-01), McConnell
patent: 4740249 (1988-04-01), McConnell
patent: 4761244 (1988-08-01), Scardera et al.
patent: 4778532 (1988-10-01), McConnell et al.
patent: 4795497 (1989-01-01), McConnell et al.
patent: 4856544 (1989-08-01), McConnell
patent: 4902608 (1990-02-01), Lamb et al.
patent: 4911761 (1990-03-01), McConnell et al.
patent: 4917123 (1990-04-01), McConnell et al.
patent: 4921572 (1990-05-01), Roche
patent: 4984597 (1991-01-01), McConnell et al.
patent: 5075256 (1991-12-01), Wang et al.
patent: 5101457 (1992-03-01), Blonder et al.
patent: 5148823 (1992-09-01), Bran
patent: 5169408 (1992-12-01), Biggerstaff et al.
patent: 5174855 (1992-12-01), Tanaka
patent: 5200024 (1993-04-01), Blonder et al.
patent: 5213650 (1993-05-01), Wang et al.
patent: 5242468 (1993-09-01), Clark et al.
patent: 5273609 (1993-12-01), Moslehi
patent: 5286657 (1994-02-01), Bran
patent: 5292273 (1994-03-01), Arita et al.
patent: 5301701 (1994-04-01), Nafziger
patent: 5308400 (1994-05-01), Chen
patent: 5311892 (1994-05-01), Adelt et al.
patent: 5370741 (1994-12-01), Bergman
patent: 5381808 (1995-01-01), Kamikawa
patent: 5383484 (1995-01-01), Thomas et al.
patent: 5389551 (1995-02-01), Kamakura et al.
patent: 5393694 (1995-02-01), Mathews
patent: 5393712 (1995-02-01), Rostoker et al.
patent: 5419351 (1995-05-01), Ciari
patent: 5425826 (1995-06-01), Sayyadi et al.
patent: 5425846 (1995-06-01), Koze et al.
patent: 5435885 (1995-07-01), Jones et al.
patent: 5448672 (1995-09-01), Blonder et al.
patent: 5460691 (1995-10-01), Kobayashi et al.
patent: 5511569 (1996-04-01), Mukogawa
patent: 5522412 (1996-06-01), Ohba et al.
patent: 5567574 (1996-10-01), Hasemi et al.
patent: 5571644 (1996-11-01), Uraguchi et al.
patent: 5578532 (1996-11-01), van de Ven et al.
patent: 5598493 (1997-01-01), Bonham, Jr. et al.
patent: 5600174 (1997-02-01), Reay et al.
patent: 5605602 (1997-02-01), DeBusk
patent: 5645737 (1997-07-01), Robinson et al.
patent: 5810940 (1998-09-01), Fukazawa et al.
Kern, W. "Overview and Evolution of Semiconductor Wafer Contamination and Cleaning Technology", Handbook of Semiconductor Wafer Cleaning Technology, Kern, W. (Ed.), Noyes Publications, Parkridge, NJ, 1993, Chapter 1, 3-67.
Burkman et al., "Aqueous Cleaning Processes", Handbook of Semiconductor Wafer Cleaning Technology, Kern, W. (Ed.), Noyes Publications, Parkridge, NJ, 1993, Chapter 3, 111-151.
"Full-Flow.TM. Wet Processing" brochure, 1993, CFM Technologies, Inc., West Chester, PA.
"CFM Technologies. The Next Generation in Wet Processing" brochure, CFM Technologies, West Chester, PA.
Horiki, H. et al., "Wet Etch Cleaning" in Ultraclean Technology Handbook, vol. 1, 805-819.
Gise, P. et al., "Semiconductor and Integrated Circuit Fabrication Techniques", 1979, Reston Publishing Co., Reston, VA.
Kern, W. "Overview and Evolution of Semiconductor Wafer Contamination and Cleaning Technology", Handbook of Semiconductor Wafer Cleaning Technology, Kern, W. (Ed.), Noyes Publication, Parkridge, NJ, 1993, Chapter 1.
Burkman et al., "Wet Chemical Processes-Aqueous Cleaning Processes", Handbook of Semiconductor Wafer Cleaning Technology, Kern, W. (Ed.), Noyes Publication, Parkridge, NJ, 1993, Chapter 3, 111-151.
Bennett "Concise chemical and technical dictionary" Chem. Pubsh. p. 473, 1976.
Horne "Microcircuit production technology" Adam Hilger Ltd., pp. 89-90, 1986.

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