Wet processing apparatus

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

118715, C23F 102

Patent

active

060276029

ABSTRACT:
An apparatus for wet processing of substrates in a controlled environment. It is a single-substrate processing apparatus which is capable of carrying out etching, rinsing, and drying processes all in a single apparatus and in a controlled environment. A closed processing chamber is provided for processing a substrate in a closed environment. Processing liquids and gases are introduced into the chamber and the chamber is rotated with the substrate. Temperature inside the chamber is controlled by heating the gases. Humidity is controlled by varying the proportion of water vapor. The rotation of the chamber with the substrate creates a stable environment where processing parameters are more easily controlled.

REFERENCES:
patent: 4557785 (1985-12-01), Ohkuma
patent: 5571367 (1996-11-01), Nakajima et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Wet processing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wet processing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wet processing apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-517379

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.