Wet etching station and a wet etching method adapted for utilizi

Details Wet etching station and a wet etching method adapted for utilizi Wet etching station and a wet etching method adapted for utilizi

1996-12-24

1998-08-04

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

216 90, H01L 21302

Patent

active

057888000

ABSTRACT:
A wet etching station and a wet etching method adapted for utilizing the same are provided. The wet etching station includes a bath apparatus containing a chemical etchant, with the bath apparatus having a plurality of cooling lines installed in the lower portion of the bath area, such that the cooling lines can make contact with the chemical etchant. Thus, a large-diameter wafer can uniformly etched.

REFERENCES:
patent: 2802726 (1957-08-01), Langsfeld
patent: 4053347 (1977-10-01), Glenn

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