Wet etching of thermally or chemically cured polyimide

Details Wet etching of thermally or chemically cured polyimide Wet etching of thermally or chemically cured polyimide

1988-07-13

1989-07-11

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156651, 156655, 156656, 1566591, 1566611, 156668, 156644, 252 792, 252 795, 427307, B44C 122, B29C 3700, C23F 102, C03C 1500

Patent

active

048469297

ABSTRACT:
Polyimide is etched by contacting the polyimide with an aqueous solution of a metal hydroxide followed by contact with an acid followed by contact with an aqueous solution of a metal hydroxide. Etching of chemically cured polyimide can be enhanced by employing a presoaking in hot water. Also, partially etched chemically cured polyimide is removed with a concentrated acid solution.
In preparing a metal coated polyimide structure for subsequent gold plating, two flash etching steps with the polyimide etch between are employed after developing the photoresist.

REFERENCES:
patent: 3758388 (1973-04-01), Shotlon
patent: 4353778 (1982-10-01), Fineman et al.
patent: 4369090 (1983-01-01), Wilson et al.
patent: 4426253 (1984-01-01), Kreuz et al.
patent: 4431478 (1984-02-01), Yamaoka et al.
patent: 4624740 (1986-11-01), Abrams et al.
patent: 4639290 (1987-01-01), Leyden et al.

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