Wet etching of cured polyimide

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156655, 1566591, 252 795, B44C 122, B29C 3700, C03C 1500, C03C 2506

Patent

active

048571431

ABSTRACT:
A fully cured or substantially fully cured polyimide is etched by contacting the imide with an aqueous solution of a metal hydroxide such as an alkali metal or alkali earth hydroxide and a metallic compound selected from metal carbonates, sulfates and phosphates. The presence of the carbonate, sulfate or phosphare reduces the undercutting of a resist pattern on the polyimide.

REFERENCES:
patent: 4078102 (1978-03-01), Bendz et al.
patent: 4411735 (1983-10-01), Belani
patent: 4426253 (1984-01-01), Kreuz et al.
patent: 4431478 (1984-02-01), Yamaoka et al.

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