Wet etching method for forming metal film pattern having tapered

Details Wet etching method for forming metal film pattern having tapered Wet etching method for forming metal film pattern having tapered

1992-02-04

1993-09-07

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 156664, 252 792, C23F 100, B44C 122

Patent

active

052425436

ABSTRACT:
A wet etching method for forming a metal film pattern having tapered edges includes preparing a metal film deposited on a substrate, performing a treatment for making the surface of the metal film hydrophilic, forming a photoresist layer pattern with phenol novolac resin as a main component on the surface of the metal film, post-baking the photoresist layer pattern at a predetermined temperature for a predetermined time and etching the metal film with etchant including nitric acid, thereby obtaining a metal film pattern having edges with a uniform taper angle desirably controlled with precision.

REFERENCES:
patent: 3700508 (1972-10-01), Keen
patent: 3825454 (1974-07-01), Kikuchi et al.
patent: 3935083 (1976-01-01), Tomozawa et al.
patent: 4022930 (1977-05-01), Fraser
patent: 4082604 (1978-04-01), Yanez
patent: 5007984 (1991-04-01), Tsutsumi et al.

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