Wet etching

Details Wet etching Wet etching

1997-01-10

1999-11-23

Breneman, R. Bruce

Etching a substrate: processes

Forming or treating electrical conductor article

216 46, 216100, H01B 1300, B44C 122

Patent

active

059894423

ABSTRACT:
Method for wet etching where proper arrangements of the substrates during the growth of the insulation layer is adopted. An insulation layer is prepared on the surface of a substrate at the area where thin film circuits are positioned. On the surfaces of the substrate where the thin film circuits are not positioned are prepared protective layers. During the wet etching the attack by the etchant may be avoided. The material of the insulation layer and the protection layer may be the same. The material of the protection layer may be the photo-resistant used in the wet etching process. The invention also disclosed circuit components prepared with the wet etching of this invention.

REFERENCES:
patent: 3847690 (1974-11-01), Campbell, Jr. et al.
patent: 5429911 (1995-07-01), Togawa et al.

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