Wet etched insulator and electronic circuit component

Details Wet etched insulator and electronic circuit component Wet etched insulator and electronic circuit component

2007-06-05

2007-06-05

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257SE21530

Reexamination Certificate

active

10074224

ABSTRACT:
The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer—insulating layer—second inorganic material layer or a layer construction of inorganic material layer—insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.

REFERENCES:
patent: 6596184 (2003-07-01), Shum et al.
patent: 6709988 (2004-03-01), Sakayori et al.
patent: 2000-183523 (2000-06-01), None

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