Etching a substrate: processes – Forming or treating electrical conductor article
Reexamination Certificate
2006-10-06
2011-11-29
Vinh, Lan (Department: 1713)
Etching a substrate: processes
Forming or treating electrical conductor article
C216S020000, C216S033000, C216S043000, C438S214000, C438S215000, C438S332000, C438S458000, C156S330900, C156S331500
Reexamination Certificate
active
08066891
ABSTRACT:
The present invention provides a laminate comprising an insulating layer having suppressed dusting properties, an insulating film comprising the insulating layer, and an electronic circuit component comprising a pattern of the insulating layer. The laminate has a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer. The insulating layer comprises a laminate of two or more wet etchable insulating unit layers. At the interface between the inorganic material layer and the insulating layer, surface irregularities of the inorganic material layer have been transferred onto the surface of the insulating layer. The average height of the surface irregularities transferred onto the insulating layer is less than the thickness of the outermost insulating unit layer in the insulating layer.
REFERENCES:
patent: 4543295 (1985-09-01), St. Clair et al.
patent: 5300364 (1994-04-01), Hase et al.
patent: 5376248 (1994-12-01), Conrod et al.
patent: 5621068 (1997-04-01), Okamoto et al.
patent: 6340518 (2002-01-01), Kitahara et al.
patent: 6379784 (2002-04-01), Yamamoto et al.
patent: 6548153 (2003-04-01), Kataoka et al.
patent: 6699572 (2004-03-01), Yamamoto et al.
patent: 2001/0010860 (2001-08-01), Yamaguchi et al.
patent: 2004/0096676 (2004-05-01), Sakayori et al.
patent: 04-043029 (1992-02-01), None
patent: 05-013902 (1993-01-01), None
patent: A-5-267810 (1993-10-01), None
patent: A-6-326158 (1994-11-01), None
patent: A-10-75053 (1998-03-01), None
patent: A-2000-13024 (2000-01-01), None
patent: 2000-71387 (2000-03-01), None
patent: 2000-190420 (2000-07-01), None
patent: A-2000-195032 (2000-07-01), None
Kawano Shigeki
Momose Terutoshi
Ohmizo Kazunori
Okamura Kazuto
Sakayori Katsuya
Angadi Maki A
Dai Nippon Printing Co. Ltd.
Oliff & Berridg,e PLC
Vinh Lan
LandOfFree
Wet etchable laminated body, insulation film, and electronic... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wet etchable laminated body, insulation film, and electronic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wet etchable laminated body, insulation film, and electronic... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4261702