Wet die cutter assembly and method

Details Wet die cutter assembly and method Wet die cutter assembly and method

1991-09-20

1993-04-20

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 156630, 156633, 156654, 156668, B44C 122, B79C 3700

Patent

active

052039617

ABSTRACT:
A wet die cutter assembly is disclosed for eating through a membrane that is soluble in a solvent. The assembly includes a supply of such a solvent and die cutter structure with a membrane-confronting surface in wetting communication with the supply. In one embodiment, the structure also includes a solvent retainer in communication with the supply and the surface for retaining solvent and making it available for pooling on the surface. The retainer includes an absorbent for drawing solvent to the surface. The surface may be blunt and may be configured in a desired shape for effecting dissolving of the membrane in a shape corresponding to that of the surface.

REFERENCES:
patent: 3915770 (1975-10-01), Santillo
patent: 4735678 (1988-04-01), Mandigo et al.
patent: 4797177 (1989-01-01), Kaya et al.

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