Wave soldering method using lead-free solder, apparatus...

Details Wave soldering method using lead-free solder, apparatus... Wave soldering method using lead-free solder, apparatus...

2006-05-23

2006-05-23

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

C228S043000

Reexamination Certificate

active

07048173

ABSTRACT:
The present invention relates to a wave soldering method and a wave soldering apparatus using lead-free solder comprising a wave soldering step in which the lower side of a substrate with leads of component parts inserted in through-holes formed in the substrate from the upper side is wave soldered by contact with a molten lead-free solder blowout at a wave soldering portion provided in a chamber, and a cooling step in which an inert gas in the chamber is recirculated and cooled and is blown to the lower side of the substrate wave soldered with the lead-free solder in the wave soldering step and being conveyed, to cool the lower side of the substrate, at a blowing portion provided adjacently to the wave soldering portion in the chamber, and an apparatus therefor.

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