Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2005-04-08
2010-06-29
Lee, Sin J. (Department: 1795)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S273100, C430S324000, C430S325000, C430S326000, C430S327000, C430S328000, C430S330000, C430S905000, C430S909000, C430S914000, C430S961000, C430S964000
Reexamination Certificate
active
07745093
ABSTRACT:
In the present invention, in a water soluble resin composition for use in a method for pattern formation in which a covering layer is provided on a resist pattern formed of a radiation-sensitive resin composition capable of coping with ArF exposure to increase the width of the resist pattern and thus to realize effective formation of higher density trench or hole pattern, the size reduction level of the resist pattern layer can be further increased as compared with that in the prior art technique, and, in addition, the size reduction level dependency of the coarse-and-fine resist pattern can be reduced. A method for pattern formation using the water soluble resin composition is also provided. The water soluble resin composition which is usable for the method for pattern formation applicable to ArF excimer laser irradiation comprises a water soluble resin, an acid generating agent capable of generating an acid upon heating, a surfactant, a crosslinking agent, and a water-containing solvent.
REFERENCES:
patent: 6555607 (2003-04-01), Kanda et al.
patent: 2003/0008968 (2003-01-01), Sugeta et al.
patent: 2003/0102285 (2003-06-01), Nozaki et al.
patent: 2004/0121259 (2004-06-01), Kozawa et al.
patent: 2006/0160015 (2006-07-01), Takano et al.
patent: 5-241348 (1993-09-01), None
patent: 6-250379 (1994-09-01), None
patent: 10-73927 (1998-03-01), None
patent: 2001-19860 (2001-01-01), None
patent: 2001-228616 (2001-08-01), None
patent: 2003-84460 (2003-03-01), None
patent: 2004-46060 (2004-02-01), None
patent: 2004-77951 (2004-03-01), None
patent: 2004-264373 (2004-09-01), None
Machine-assisted English translation of JP2004-264373 provided by JPO.
English Language Abstract of JP 5-24348 A, Sep. 21, 1993.
English Language Abstract of JP 6-230379 A, Sep. 9, 1994.
English Language Abstract of JP 10-73927 A, Mar. 17, 1998.
English Language Abstract of JP 2001-228616 A, Aug. 24, 2001.
Hong Sung Eun
Nishibe Takeshi
Okayasu Tetsuo
Takano Yusuke
AZ Electronic Materials USA Corp.
Jain Sangya
Lee Sin J.
LandOfFree
Water soluble resin composition and method for pattern... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Water soluble resin composition and method for pattern..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Water soluble resin composition and method for pattern... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4242320