Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2007-09-18
2007-09-18
Walke, Amanda (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S281100, C430S286100, C430S311000
Reexamination Certificate
active
10999412
ABSTRACT:
Photoresist patterns are formed using a photoresist composition, which includes water, a photoacid generator, and a negative photoresist polymer. The polymer includes a basic-type repeating unit represented by Formula (I) (shown below), so that a developing process can be performed not by using conventional TMAH solution but by using water. Additionally, since the main solvent of the composition is water, the disclosed photoresist composition is eco-friendly, and has a low light absorbance at 193 nm and 248 nm, which is useful in a photolithography process using light source in a far ultraviolet region when high-integrated fine circuits of semiconductor device are manufactured.wherein R1, R2, R3, R4, R5, R6, R7, b, c, d and m are defined in the specification.
REFERENCES:
patent: 4925913 (1990-05-01), Teramoto et al.
patent: 5272026 (1993-12-01), Roland et al.
patent: 6399273 (2002-06-01), Yamada et al.
patent: 6875556 (2005-04-01), Harada et al.
patent: 2000098630 (2000-04-01), None
patent: 10-1998-015678 (1998-05-01), None
CA DN 122:12205 for JP 06073146, Mar. 1994.
Hynix / Semiconductor Inc.
Walke Amanda
LandOfFree
Water-soluble negative photoresist polymer, composition... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Water-soluble negative photoresist polymer, composition..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Water-soluble negative photoresist polymer, composition... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3795796