Water mark defect prevention for immersion lithography

Details Water mark defect prevention for immersion lithography Water mark defect prevention for immersion lithography

2011-04-19

2011-04-19

Kelly, Cynthia H (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S280100

Reexamination Certificate

active

07927779

ABSTRACT:
A photoresist material having a polymer that turns soluble to a base solution in response to reaction with acid. The material includes a photo-acid generator (PAG) that decomposes to form acid in response to radiation energy and a quencher capable of neutralizing acid and having a reduced mobility. The photoresist material can thereby prevent water mark defects from immersion lithography.

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