Water developable photosensitive resin composition, and resin or

Details Water developable photosensitive resin composition, and resin or Water developable photosensitive resin composition, and resin or

1990-03-12

1992-03-31

Hamilton, Cynthia

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430281, 430909, 430306, 430325, 430327, 430288, 522121, 522123, 522120, G03F 7033, G03F 730

Patent

active

051007630

ABSTRACT:
Disclosed is a water-developable photosensitive resin composition capable of hot melt molding, which comprises:

REFERENCES:
patent: 2902365 (1959-09-01), Martin
patent: 4621044 (1986-11-01), Fujikawa
Photocurable Liquid Resin Composition, Abstract of Japan APP56-131609, from Patent Abstracts of Japan, Jun. 16, 1982.
Research Disclosure 24919, "Process for Producing a Photosensitive Composition by Melt Extrusion," Jan. 1985.

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