Water-cooled heat dissipation device for a notebook computer

Details Water-cooled heat dissipation device for a notebook computer Water-cooled heat dissipation device for a notebook computer

2008-03-20

2010-02-16

Vortman, Anatoly (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S679530, C361S679550, C361S695000, C361S698000, C361S689000

Reexamination Certificate

active

07663876

ABSTRACT:
A water-cooled heat dissipation device for a notebook computer includes primarily a pad and a heat dissipation device at a bottom of the pad having an air through-hole. The heat dissipation structure has a fan below a U-shape plate, a groove of which is latched with parallel fins being transfixed with a metallic tube in a detouring way, with two ends of the metallic tube being connected to a water pump, allowing cooling water to circulate in the metallic tube to cool down the fins. The heat dissipation structure is fixed below the air through-hole of the pad with the two ends of the U-shape plate. In usage, a notebook computer is put on the pad, and temperature of the notebook computer is conducted to the pad. Furthermore, cold wind is blown to the pad by the fan, such that the notebook computer can be cooled down rapidly.

REFERENCES:
patent: 6071082 (2000-06-01), Lecinski et al.
patent: 6115249 (2000-09-01), Cipolla et al.
patent: 6170563 (2001-01-01), Hsieh
patent: 6239971 (2001-05-01), Yu et al.
patent: 6414842 (2002-07-01), Cipolla et al.
patent: 6466438 (2002-10-01), Lim
patent: 6738256 (2004-05-01), Hsieh et al.
patent: D522002 (2006-05-01), Cheng
patent: 7038909 (2006-05-01), Chen
patent: 7177150 (2007-02-01), Kazuhiro
patent: D543209 (2007-05-01), Bae
patent: D554647 (2007-11-01), Chan
patent: D555162 (2007-11-01), Park et al.
patent: 7301765 (2007-11-01), Huang
patent: D557267 (2007-12-01), Beilstein et al.
patent: 7336489 (2008-02-01), Chen et al.
patent: D579455 (2008-10-01), Chu
patent: 7453694 (2008-11-01), Lee
patent: 2002/0186531 (2002-12-01), Pokharna et al.
patent: 2003/0058615 (2003-03-01), Becker et al.
patent: 2003/0231466 (2003-12-01), Huang
patent: 2004/0060687 (2004-04-01), Moss, II
patent: 2006/0232935 (2006-10-01), Xiong
patent: 2007/0097643 (2007-05-01), Cheng
patent: 2008/0037213 (2008-02-01), Haren
patent: 2009/0068910 (2009-03-01), Fredrick et al.
patent: 2009/0179131 (2009-07-01), Lord et al.
patent: 2009/0212180 (2009-08-01), Lord
patent: 2002031448 (2002-01-01), None

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