Water and acid developable photoresist composition exhibiting im

Details Water and acid developable photoresist composition exhibiting im Water and acid developable photoresist composition exhibiting im

1994-10-13

1997-01-07

Chapman, Mark

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

4302811, 522 31, 522103, G03C 1725

Patent

active

055915620

ABSTRACT:
A photopolymerizable composition suitable as a solder resist and capable of forming a resist film having characteristics in no way inferior to those of the conventional heat-curable type or organic solvent developed type solder resist, with the use of water or a dilute aqueous solution which is completely innocuous and higher in safety than the aqueous alkaline solution, and a method for producing a cured coated film pattern using the photopolymerizable composition.

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