Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent
1995-08-24
1999-02-23
Arroyo, Teresa M.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
257786, 257737, 257783, 257503, 257691, H01L 2348, H01L 2900, H01L 2352, H01L 2940
Patent
active
058747826
ABSTRACT:
Disclosed is a semiconductor wafer, and the method of making the same, the wafer being formed to have a multiplicity of raised contact pads on its surface. The contact pads are formed with conductors which are disposed on the surface of the wafer and which are coupled to internal circuitry embedded in the wafer through vias in the wafer's surface. The contact pads are in a raised elevational relationship relative to the surface conductors. After the wafer is fully processed, by dicing individual integrated circuit chips out of the wafer, each chip can then be mounted on a higher level of assembly, such as a printed circuit board. The raised contact pads originally formed on the wafer, and therefore formed on each individual chip, provide the contact points by which the chip can be bonded with matingly arranged contact pads on the higher level of assembly.
REFERENCES:
patent: 3373323 (1968-03-01), Wolfrum et al.
patent: 3636619 (1972-01-01), Welms et al.
patent: 3647644 (1972-03-01), Russell
patent: 3653999 (1972-04-01), Fuller
patent: 3673016 (1972-06-01), Gerstner
patent: 3690984 (1972-09-01), Wanesky
patent: 3697828 (1972-10-01), Oakes
patent: 3747202 (1973-07-01), Jordan
patent: 3771219 (1973-11-01), Tuzi et al.
patent: 3772575 (1973-11-01), Hegarty et al.
patent: 3811183 (1974-05-01), Celling
patent: 4086375 (1978-04-01), LaChapelle, Jr. et al.
patent: 4622574 (1986-11-01), Garcia
patent: 4862322 (1989-08-01), Bickford et al.
patent: 5134460 (1992-07-01), Brady et al.
patent: 5376574 (1994-12-01), Peterson
patent: 5403729 (1995-04-01), Richards et al.
patent: 5477087 (1995-12-01), Kawakita et al.
patent: 5668410 (1997-09-01), Yamamoto
RC 18414 "Aluminum Bump for Tape-Automated Bonding", by Moskowitz, P.A., Bickford, H.R., Kang, S.K., Palmer, M.J., and Reiley, T.C., Jun. 26, 1992, pp. 1-7.
Arroyo Teresa M.
International Business Machines - Corporation
Walsh Robert A.
LandOfFree
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