Wafer type probe card, method for fabricating the same, and...

Details Wafer type probe card, method for fabricating the same, and... Wafer type probe card, method for fabricating the same, and...

2007-08-23

2009-11-10

Tang, Minh N (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S761010

Reexamination Certificate

active

07616015

ABSTRACT:
Example embodiments may provide a wafer type probe card, a method of fabricating a wafer type probe card, and/or a semiconductor test apparatus having the wafer type probe card. The wafer type probe card may include a semiconductor and a plurality of probing chips. The semiconductor substrate may include a plurality of probing area each including a first surface and/or a second surface opposite to the first surface. Each of the plurality of probing chips may include a plurality of conductive first pads arranged in the first surface of each of the plurality of probing areas and/or a plurality of conductive second pads arranged in the second surface of each the plurality of probing chips to be respectively connected to the first pads.

REFERENCES:
patent: 6215321 (2001-04-01), Nakata
patent: 6614246 (2003-09-01), Kohno et al.
patent: 6970005 (2005-11-01), Rincon et al.
patent: 7292055 (2007-11-01), Egitto et al.
patent: 2004/0012405 (2004-01-01), Cheng et al.
patent: 2005/0101037 (2005-05-01), Farnworth et al.
patent: 2000-357718 (2000-12-01), None
patent: 2001-210685 (2001-08-01), None
patent: 10-0214162 (1999-05-01), None

Affiliated with

Also associated with

Rating

Wafer type probe card, method for fabricating the same, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer type probe card, method for fabricating the same, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer type probe card, method for fabricating the same, and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4120966