Wafer tweezer assembling device

Details Wafer tweezer assembling device Wafer tweezer assembling device

1997-03-03

1999-06-01

Cherry, Johnny D.

Metal working

Means to assemble or disassemble

Including means to relatively position plural work parts

294 641, 414741, 269296, B25B 120

Patent

active

059078952

ABSTRACT:
The present invention provides a wafer tweezer assembling device by utilizing a chuck member and a plurality of tweezer blades separated by spacers having a predetermined thickness such that the mounting and the calibration of the tweezer can be accomplished in one operation without the need of further calibration steps after the assembling process.

REFERENCES:
patent: 4165067 (1979-08-01), Jernigan
patent: 4755340 (1988-07-01), Ermer
patent: 5382128 (1995-01-01), Takahashi et al.
patent: 5556147 (1996-09-01), Somekh et al.
patent: 5562387 (1996-10-01), Ishii et al.
patent: 5647626 (1997-07-01), Chen et al.

Affiliated with

Also associated with

Rating

Wafer tweezer assembling device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer tweezer assembling device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer tweezer assembling device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-948485