Wafer treatment method using hydrophilic making fluid supply

Details Wafer treatment method using hydrophilic making fluid supply Wafer treatment method using hydrophilic making fluid supply

1999-01-27

2000-02-08

Gulakowski, Randy

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

134 36, 134 2, B08B 600

Patent

active

060217863

ABSTRACT:
A semiconductor manufacturing apparatus for rinsing a wafer after chemically treating the wafer includes a spin chuck for holding the wafer, a first supply nozzle located above the spin chuck and a second nozzle connected to a lower end of the spin chuck. First and second chemical fluid supply pipes are connected at one end to a chemical fluid supply and at the other end to respective ends of the first and second supply nozzles. First and second deionized water supply pipes are connected at one end to a deionized water supply and at the other end to respective ends of the first and second supply nozzles. A hydrophilic-making fluid supply pipe is connected at one end to hydrophilic-making fluid supply and at the other end to the end of the first supply nozzle. It is thus possible to prevent the generation of watermarks at the boundary between hydrophobic material and hydrophilic material by performing a rinsing operation after changing the hydrophobic material into hydrophilic material.

REFERENCES:
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patent: 5487398 (1996-01-01), Ohmi et al.
patent: 5778911 (1998-07-01), Yoshio
Kern, Werner. Handbook of Semiconductor Cleaning Technology. Noyes Publications. pgs. 128-129.

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