Wafer treatment method for protecting fuse box of...

Details Wafer treatment method for protecting fuse box of... Wafer treatment method for protecting fuse box of...

2005-01-11

2005-01-11

Niebling, John F. (Department: 2812)

Semiconductor device manufacturing: process

Making device array and selectively interconnecting

Using structure alterable to nonconductive state

C438S601000, C257S529000

Reexamination Certificate

active

06841425

ABSTRACT:
Methods for treating a wafer to protect a fuse box of a semiconductor chip are provided. These methods include applying an insulating coating solution onto the surface of at least one of a plurality of fuse boxes in a semiconductor chip so as to prevent moisture or impurities from seeping into the fuse box. With these methods, the degradation of the semiconductor chip can be substantially reduced by protecting the fuse box from a high-temperature and very humid atmosphere, and impurities such as particles. Thus, characteristics and reliability of the semiconductor chip can be also improved.

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