Material or article handling – Apparatus for moving intersupporting articles into – within,... – Stack forming apparatus
Patent
1995-05-10
1997-06-10
Underwood, Donald W.
Material or article handling
Apparatus for moving intersupporting articles into, within,...
Stack forming apparatus
414225, 414937, 414939, 414941, B65G 6500
Patent
active
056369646
ABSTRACT:
A semiconductor wafer processing system for processing wafers from a wafer storage cassette includes a wafer transfer chamber; a wafer storage elevator within the transfer chamber; one or more wafer processing chambers; and a wafer transfer apparatus for transferring a wafer between a standard storage cassette adjacent and outside the transfer chamber and the elevator, and between the elevator and the processing chamber. The storage chamber pressure varies between atmospheric when accepting wafers from outside, and a subatmospheric pressure when transferring wafers to or from a processing chamber. The transfer apparatus includes a robot arm; a thin flat wafer carrying blade at the leading end of the robot arm configured for engaging a wafer from the storage cassette or the elevator; and a wafer support tray configured for removable engagement with the blade and for engaging and positively positioning a wafer from the elevator, or a support pedestal within a processing chamber. When the transfer apparatus moves a wafer between the elevator and a processing chamber in an evacuated enviroment, the tray is engaged with the blade and helps retain the wafer during transit. When wafers are transferred between the cassette and the elevator at atmospheric pressure the tray is disengaged from the blade and placed in a rest position on the elevator, and the wafer transfer is performed by means of the blade alone with a vacuum pick integral to the blade. The blade includes upper and lower halves together defining vacuum channels and capacitive position sensors.
REFERENCES:
patent: 4682928 (1987-07-01), Foulke et al.
patent: 4720130 (1988-01-01), Andou
patent: 4773687 (1988-09-01), Bush et al.
patent: 4850631 (1989-07-01), Dotsko
patent: 4951601 (1990-08-01), Maydan et al.
patent: 4960298 (1990-10-01), Moroi
patent: 5004399 (1991-04-01), Sullivan et al.
patent: 5046909 (1991-09-01), Murdoch
patent: 5054831 (1991-10-01), Ting et al.
patent: 5061144 (1991-10-01), Akimoto et al.
patent: 5445486 (1995-08-01), Kitayama et al.
Fairbairn Kevin
Faraco, Jr. W. George
Kolstoe Gary M.
Somekh Sasson
White Gregory W.
Applied Materials Inc.
Taylor John P.
Underwood Donald W.
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