Wafer transport method

Details Wafer transport method Wafer transport method

1996-05-03

1997-02-11

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 216 67, H01L 2100

Patent

active

056016867

ABSTRACT:
A wafer transport method including the steps of preparing a semiconductor process equipment having a transport chamber, a process chamber, an interface means for connecting the transport chamber to the process chamber, and a transport means for transporting a semiconductor wafer from the transport chamber to the process chamber by way of the interface means; inserting the transport means mounting a substrate in a communicating corridor including a supply means and an exhaust means; and transporting the substrate while performing the supply and exhaust by sequentially controlling a supply shutoff means, an exhaust shutoff means, and a communicating shutoff means according to the position of a conductance part formed of a gap between the transport means and the communicating corridor. With this method, the substrate is transported at a high throughput without the contamination on the substrate while keeping the different atmospheric conditions of the transport chamber and the process chamber, thereby manufacturing a semiconductor device with a high performance.

REFERENCES:
patent: 4477311 (1984-10-01), Mimura et al.
patent: 4587002 (1986-05-01), Bok
patent: 5013385 (1991-05-01), Maher et al.

Affiliated with

Also associated with

Rating

Wafer transport method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer transport method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer transport method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-338919