Wafer translator having metallization pattern providing high...

Details Wafer translator having metallization pattern providing high... Wafer translator having metallization pattern providing high...

2008-03-24

2009-08-25

Karlsen, Ernest F (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S765010, C439S068000

Reexamination Certificate

active

07579852

ABSTRACT:
A metallization pattern for a wafer translator provides a high density layout of interdigitated contact pads, suitable for component placement, along with larger contact pads suitable for connection to external equipment terminals. In another aspect, electrically conductive material may be added to, or removed from, the high density layout of interdigitated contact pads and larger contact pads to modify, or reconfigure, the electrical pathways of the wafer translator.

REFERENCES:
patent: 4862077 (1989-08-01), Horel et al.

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