Wafer transfer system

Material or article handling – Apparatus for moving material between zones having different... – For carrying standarized mechanical interface type

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Details

110180, 118724, 118728, 118733, 204298, 414225, 432237, B65G 100, C23C 1400

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active

046343318

ABSTRACT:
Apparatus for programmably orienting a semiconductor wafer in an ion implantation system so as to limit channeling and to control the depth of penetration of impinging ions. The apparatus is associated with a processing chamber door and includes a rotatable vacuum chuck for engaging the wafer and a motor for rotating the vacuum chuck and the wafer through a preselected angular displacement. The apparatus further includes a programmable control assembly operative to deenergize the motor upon sensing rotation of the vacuum chuck through the preselected angular displacement. The wafer orientation apparatus is typically utilized in a system for the vertical transfer of wafers between a cassette and a processing chamber.

REFERENCES:
patent: 3340176 (1967-09-01), Belluso et al.
patent: 3521765 (1970-07-01), Kauffman et al.
patent: 3649512 (1972-03-01), Ackley
patent: 3981791 (1976-09-01), Rosvold
patent: 4047624 (1977-09-01), Dorenbos
patent: 4261762 (1981-04-01), King
patent: 4282924 (1981-08-01), Faretra
patent: 4306731 (1981-12-01), Shaw
patent: 4311427 (1982-01-01), Coad et al.
patent: 4412771 (1983-11-01), Gerlach et al.
patent: 4416755 (1983-11-01), Ceasar et al.
IBM Technical Disclosure Bulletin, vol. 19, No. 6, Nov. 1976, pp. 2270-2271, Hammer, "Cooling Ion-Implantation Target".
IBM Technical Disclosure Bulletin, vol. 22, No. 2, Jul. 1979, pp. 550-554, Carbone et al, "Ultra-High Vacuum Evaporation/Sputtering Apparatus for Cryogenic Thin Film Technology".
Industrial Research & Dev., Mar. 81, F. T. Turner & M. Hutchinson "Individual Wafer Metallizing System-A Case History".
Industrial Research & Dev., Apr. 1981, F. T. Turner & M. Hutchinson "Individual Wafer Metallying System-A Case History, Part 2".

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