Handling: hand and hoist-line implements – Utilizing fluid pressure – Venturi effect
Reexamination Certificate
2005-08-16
2005-08-16
Kramer, Dean J. (Department: 3652)
Handling: hand and hoist-line implements
Utilizing fluid pressure
Venturi effect
C414S941000, C901S040000
Reexamination Certificate
active
06929298
ABSTRACT:
A wafer transfer apparatus includes a robot arm and a robot arm cleaning device that injects purge gas into a vacuum nozzle of the robot arm under a normal stand-by state wherein the robot arm does not suction a wafer, to clean the vacuum nozzle. The robot arm cleaning device comprises a solenoid valve adapted to supply and intercept air, a first air valve adapted to selectively maintain and release a vacuum state in response to the air supplied from the solenoid valve, and a second air valve adapted to selectively supply and intercept a purge gas in response to the air supplied from the solenoid valve. The robot arm holds a wafer by a vacuum state of the vacuum nozzle when the first air valve is opened, and the vacuum nozzle is cleaned by the purge gas supplied when the second air valve is opened.
REFERENCES:
patent: 2999715 (1961-09-01), Firestone
patent: 3219380 (1965-11-01), Carliss
patent: 4773687 (1988-09-01), Bush et al.
patent: 4858975 (1989-08-01), Ogawa
patent: 5188411 (1993-02-01), Golden
patent: 5451086 (1995-09-01), Pazzaglia
patent: 5622400 (1997-04-01), George
patent: 5915910 (1999-06-01), Howells et al.
patent: 6068316 (2000-05-01), Kim et al.
Kramer Dean J.
Samsung Electronics Co,. Ltd.
Volentine Francos & Whitt PLLC
LandOfFree
Wafer transfer apparatus and device and method for cleaning... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wafer transfer apparatus and device and method for cleaning..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer transfer apparatus and device and method for cleaning... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3521165