Wafer support device

Coating apparatus – Gas or vapor deposition – Work support

Patent

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Details

118715, 118728, 156345, C23C 1600

Patent

active

058206850

ABSTRACT:
A wafer support device which supports a wafer horizontally from below in the process chamber of the semiconductor production device. A plate-shaped susceptor is placed below the wafer so that the plate surface is parallel to the wafer and has at least three through holes passing through it vertically. Lift pins which can each move axially pass through each of the through holes in the susceptor. Protrusions which support the wafer from its lower surface and which form a space between the wafer and the susceptor are installed on the upper ends of the lift pins. In this way reaction gas can flow between the wafer (2) and the susceptor (21) and form a thin film on the bottom surface of the wafer (2) as well as on the top surface.

REFERENCES:
patent: 5589224 (1996-12-01), Tepman

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