Wafer stage for wafer processing apparatus

Details Wafer stage for wafer processing apparatus Wafer stage for wafer processing apparatus

2005-05-17

2005-05-17

Fuqua, Shawntina (Department: 3742)

Electric resistance heating devices

Heating devices

Radiant heater

C392S418000, C219S390000, C219S405000, C219S457100, C219S464100, C219S121430, C118S724000, C118S725000, C118S728000

Reexamination Certificate

active

06895179

ABSTRACT:
A wafer stage for use in a wafer processing apparatus having a liquid cooling jacket with a built-in coolant liquid circulation path and a ceramic plate as attached onto the liquid cooling jacket and having therein a heater and an electrode for an electrostatic chuck. The wafer stage enables performance of wafer processing while letting a wafer be mounted on the ceramic plate. The liquid cooling jacket enables attachment of the ceramic plate through a gap for circulation of a coolant gas as formed over the liquid cooling jacket, and a heat resistant seal material containing therein an elastic body for sealing the coolant gas between the liquid cooling jacket and the ceramic plate.

REFERENCES:
patent: 5709757 (1998-01-01), Hatano et al.
patent: 5835334 (1998-11-01), McMillin et al.
patent: 5851298 (1998-12-01), Ishii
patent: 7-176601 (1995-07-01), None
patent: 2001-110885 (2001-04-01), None

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